HEICO

About Us

3D PLUS is a world leading supplier of advanced high density 3D microelectronic products and Die and Wafer Level stacking technology meeting the demand for high reliability, high performance and very small size of today’s and tomorrow’s electronics. Its patented technology portfolio starts with standard package scale upward to die-size and wafer-level stacking processes, and, enables stacking heterogeneous active, passive, Opto-electronics and MEMS/MOEMS devices in a single highly miniaturized package.